Scribe device wafer substrate processing
High speed, high quality! This is a semi-automatic scriber compatible with 4-inch wafers.
This is a semi-automatic scribing device compatible with 4-inch wafers, featuring independent processing axis, feed axis, and camera axis. Unlike spring-based systems, it is not affected by the depth of the cut, allowing for a constant load, and the air suspension effect significantly reduces tool jumping. Additionally, to minimize vibrations on the drive side, it is equipped with a linear servo motor, enabling more precise scribing. 【Features】 ■ High rigidity design and high throughput ■ Auto-alignment function ■ Tool pressure control via air ■ Equipped with linear servo motor *For more details, please refer to the PDF document or feel free to contact us.
- Company：くまさんメディクス MPSD事業部 大津第1工場
- Price：Other
